DRAM
DRAM contract price would hike higher than expected in the coming quarter
After the Chinese lunar year holidays, the trading activity gets better.
The inquiries and transaction from the spot market increased obviously.
The spot price pushed to a higher level and the price uptrend would extend further.
Within this month, 8Gbit DDR4 component price increased 10~15% and 2Gbit/4Gbit DDR3 component price raised around 30%.
The Channel module ASP increased a lot for both UDIMM/RDIMM, the price is following the DRAM component price.
The contract price would increase more than expected as well, the UDIMM and RDIMM module ASP would try to catch up with the channel pricing in the coming quarter.
The ASP could increase 15%+ for UDIMM and RDIMM, the mobile DRAM related solutions could increase high single digit next quarter.
NAND
Retail NAND products’ ASP increasing and may expect contract price rebound in the coming quarter
Due to the stable raw Nand price and key component ASP increasing, the end product price keeps increasing.
The retailed SSD keeps increasing and vendors prefer to build high-density SSD due to insufficient controller support.
Raw Nand price slightly up this month and demand from module marker is good.
The PC cSSD demand keeps strong momentum, some PC OEMs like to pull in demand from the second quarter.
The suppliers have high confidence to see OEM cSSD price up next quarter, the price rebound is earlier than expected.
Suppliers are expecting mid to low single digit up in 2Q21 compared with this quarter.
In addition, the high density uMCP demand is improving, the upside volume from China vendors get more.
The MCP solutions ASP could increase more than others NAND products because of the significant DRAM ASP raising in 2Q21.