DRAM
The spot market demand is soft this month, both computing and consumer DRAM price declined low to mid single digit within this month.
The high BOM cost pressure seems impact the market demand, the OEMs are hesitate to pursue high cost components due to low profit margin and the possible high cost inventory in the future.
However, the contract market showed strong momentum this quarter, the UDIMM contract price raised as expected and RDIMM contract price could increase more than expected.
Regarding the smartphone related products, the ASP hike more than original projection. Even through the smartphone inventory level increased since end of last month.
The server RDIMM price keeps increasing, some vendors are trying to sell at higher price for Tier2 customers this quarter.
We may expect another 10% QoQ price increasing in 3Q21 for both PC and Server segment.
NAND
The high NAND wafer and SSD controller cost can not push the channel cSSD selling price increasing.
Channel SSD demand is weak this month, the most of SSD density official offering price is stable.
The cryptocurrency Chia enhanced the HDD and high density SSD demand, the 1T SSD ASP slightly increase in the last week of April.
The NAND wafer price increased as contract price raised and limited supply in this quarter, which is a high single digit QoQ increase.
Regarding the contract market, the contract price increased slightly lower than expected.
In addition, some demand side customer tends to see April ASP adjust down as their inventory at related high level, which is not an easy task.
Moreover, the high density UFS ASP increased less than expected, the high channel set inventory could be the pressure.
The xMCP ASP increased more compared wih UFS products due to DRAM ASP increases much more than NAND this quarter.