Entry-level smartphone demand remains soft, with the trend continuing to deteriorate.
Smartphone AP orders could see a sharp decline next year, particularly in the low-end segment.
Apple’s newly launched Mac mini and Mac Studio point to a further ASP uplift.
This could imply a greater-than-expected price hike for the upcoming new iPhone.
The PC market was soft in early 3Q26; full-year shipment targets face downside risk, with inventory levels likely to build.
Server demand remains robust, with a positive outlook heading into next year.
DRAM
DDR5 UDIMM contract prices for PC OEMs to rise approximately 20% this quarter, followed by a high-single-digit increase in 4Q26.
DDR5 RDIMM contract prices increased in the 20% range; demand remained robust, with a notable shift from high-density to lower-density modules.
Demand for 128GB and 96GB RDIMM is migrating toward 64GB, as CSPs reduce per-module density in favor of deploying a greater number of modules.
Availability of 96GB and 128GB RDIMM modules in the spot/channel market has been increasing.
The LPDRAM price for Smartphone markets is getting stable in 3Q26, with ASP increases of less than 10%.
Consumer DRAM contract prices rose by a high-single-digit percentage this month, approaching the $3/Gbit level.
Channel DRAM prices continued to trend upward, with DDR5 registering steeper price gains than DDR4.
DDR5 module demand remained stable; certain suppliers have attempted to raise selling prices, resulting in a modest ASP uptick.
Module houses attempted to raise DDR4 module selling prices, though the attempt was unsuccessful.
Separately, module houses are looking to expand their RDIMM business by sourcing x4 components from DRAM makers.
In the downgrade/reball market, x4 components are being converted into x8 configurations to produce lower-density RDIMM, stepping module density down from 32GB to 16GB for DDR4 RDIMM.
This month, in the spot market,
16G DDR5 x8 original brand component up 3%
16G DDR4 x8 original brand component up 3%.
16G DDR4 x8 ETT/UTT grade component up 20%.
16G DDR4 x16 original brand component up 4%.
8G DDR4 x8 original brand component up 5%.
8G DDR4 x8 ETT/UTT grade component up 0%.
8G DDR4 x16 original brand component down 2%.
8G DDR4 x16 ETT/UTT grade component up 19%.
NAND
cSSD contract prices for PC OEMs rose 25% this quarter, in line with expectations.
As PC demand has weakened, PC makers have become less willing to purchase additional volume at this stage.
eSSD contract prices increased over 20% this quarter, with an approximate 10% increase expected in 4Q26.
Demand for boot SSDs and server-attached eSSD is increasingly tracking the rise in agentic AI demand.
UFS prices rose around 20% this quarter, with next quarter’s price increase expected to be in the high-single-digit to 10% range.
Demand for 32GB/64GB 3D NAND eMMC remains soft, with channel inventory levels elevated.
Spot prices for these two items have declined accordingly.
Channel SSD ASP has remained stable, though pricing for certain offerings rose by a low-single-digit percentage as customers were compelled to purchase.
Raw NAND wafer prices are stable, as customers cannot accept an ASP increase given the current slow channel market.
Prices are likely to remain stable this quarter.