DRAM
Demand stayed at conservative momentum, ASP severely dropped
The RDIMM contract price declined more than expected in the second half of this year, some volume deal price is low.
The UDIMM OEM demand is weak in CQ3, the PC OEMs are lowing down their inventory level.
Smartphone market has no improving, the component and assembly volume cut a lot.
The channel demand slightly improved compared with last month due to some bidding case.
Some specific low grade component inquiry increased in the second half of this month, and the white brand component price up.
The module house bought DRAM more than last month.
However, the overall DRAM channel price dropped a lot, the consumer DRAM official price declined significantly in the end of this month.
16/8G DDR4 x8 original brand component declined 8~10%.
16 DDR4 x8 ETT/UTT grade component declined high single digit.
4G DDR3 x16 original brand component declined 10%+.
4G DDR3 x16 ETT/UTT grade component declined high single digit.
NAND
The overall NAND Flash demand remained sluggish
The contract market demand has no improving,
Some vendors are promoting QLC SSD to PC OEMs, but it seems the leading PC OEMs have less interesting in it so far.
The smartphone market remained soft, the shipment gets weaker in the second half of this month.
The consumer related memory price declined in the second half of this month. The low density eMMC price dropped a lot.
The raw NAND market demand is poor, event through the raw NAND price has dropped significantly.
Some module house’s inventory is high, and the client SSD shipment is not well.
However, the spot trading price is much lower than the price offered by the NAND Flash vendors.
Based on the current market atmosphere and demand status, the raw NAND price would decline furthermore in the coming months.